Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
Direct-drive motor for bonding head operation
Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
Automatic angle correction system for wafer frame
Automatic wafer ring loading/unloading system for enhanced production efficiency
Precision automation ensures improved production efficiency and reduced operational costs

Technical Specifications

Production Cycle	150ms (depends on chip size and bracket)
XY Accuracy	±1mil (±0.025mm)
Die Rotation	±3°
Die XY Workbench
Die Dimensions	3mil×3mil-80mil×80mil (0.076mm×0.076mm-2mm×2mm)
Max. Angle Correction	±15°
Max. Die Ring Size	6″ (152mm) outer diameter
Max. Die Area	4.7″ (119mm) after expansion
Resolution Ratio	0.04mil (1μm)
Thimble Z Height Stroke	80mil (2mm)
Image Recognition System
Grey Scale	256 (Level Grey)
Resolution	720(H)×540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder	105° rotatable die bonding
Die Bond Pressure	Adjustable 30g-250g
Loading Workbench
Range of Stroke	500mm×120mm
XY Resolution	0.02mil (0.5μm)
Suitable Holder's Size
Length	300mm-500mm
Width	80mm-120mm
Facilities Needed
Voltage/Frequency	220V AC±5%/50HZ
Compressed Air	0.5MPa (MIN)
Rated Power	1200W
Gas Consumption	40L/min
Volume and Weight
Dimensions (L×W×H)	1900×980×1620mm
Weight	1200KG

Frequently Asked Questions

Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?

Consult with us online or via email
Negotiate and confirm final price, shipping, and payment terms
Receive and confirm proforma invoice
Make payment as specified
We prepare your order after full payment confirmation
100% quality check before shipping
Delivery by air or sea

Why choose our company?

We are the actual manufacturers
Over ten years of experience in the machine industry
Commitment to high quality and timely delivery
24-hour after-sales support

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Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

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Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

MOQ:	1
Harga:	$28,000-28,500

Informasi Rinci

Deskripsi Produk

Informasi Rinci

Berat:

1200kg

Waktu siklus:

150 md

Akurasi XY:

±0,025mm

Rotasi Mati:

± 3 °

Dimensi Mati:

0,076mm*0,076mm-2mm*2mm

Koreksi Sudut Maks:

± 15 °

Cincin Mati Maks:

152mm

Area Mati Maks:

119mm

rasio resolusi:

1μm

Pukulan bidal:

2mm

Skala abu -abu:

256

Resolusi gambar:

720x540 piksel

Tekanan Ikatan Mati:

30g-250g

Resolusi XY:

0,5μm

Nilai Daya:

1200W

Kuantitas min Order:

Harga:

$28,000-28,500

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±1mil Accuracy Flip Chip Die Bonder Machine

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