Brief: Discover the Infrared BGA Rework Station DH-A2E, a high-performance automatic mobile phone repair machine designed for IC replacement and motherboard repairs. Featuring an optical alignment system, automatic disassembly, and precise temperature control, this rework station ensures professional-grade repairs with ease.
Related Product Features:
High-definition optical alignment system for precise chip mounting and guaranteed repair success.
Automatic disassembly, welding, and recovery with one-key operation for seamless repairs.
Three-temperature zone independent control for tackling various chip repair challenges.
Imported infrared wave light tube ensures fast heating and stable temperature for minimal motherboard deformation.
Touch screen operation with real-time data display and automatic analysis for user-friendly control.
Manual and automatic operation modes for flexible debugging and batch repairs.
Microcrystal panel preheating area prevents small devices from falling into the machine.
Suitable for a wide range of chip rework including POP, SOP, SOJ, QFP, QFN, BGA, and more.
Pertanyaan Umum:
What types of chips can the DH-A2E rework station handle?
The DH-A2E is suitable for various chip types including POP, SOP, SOJ, QFP, QFN, BGA, PLCC, and SCPP, making it versatile for multiple repair needs.
How does the automatic optical alignment system improve repair success?
The high-definition optical alignment system ensures precise chip mounting with a 0.01mm accuracy, significantly increasing the success rate of repairs.
What safety features does the DH-A2E rework station include?
The station features electronic pressure induction protection, infrared induction protection (optional), and an emergency switch with automatic power-off for enhanced safety during operation.